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| A processor instruction set by AMD designed to improve performance with 3D graphics and other multimedia data. |
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| ACPI (Advanced Configuration and Power Interface) |
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| Specification developed by Intel, Compaq, Phoenix, Microsoft, and Toshiba to control power on computers and other devices. |
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| The portion of a processor’s internal bus that connects the processor to the internal memory cache. The bus operates at a much higher frequency than the front side bus. |
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| A Windows error that displays against a blue screen and causes the system to halt. |
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| Defined by ACPI and used by a processor to stop its internal operations to conserve power. |
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| A fan inside a computer case used to draw air out of or into the case. |
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| A technology used by Intel whereby the processor, chipset, and wireless network adapter are all interconnected as a unit which improves laptop performance. |
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| A round air duct that helps to pull and direct fresh air from outside a computer case to the cooler and processor. |
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| A feature of AMD processors that lowers power requirements and helps keep a system quiet. |
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| A combination cooling fan and heat sink mounted on the top or side of a processor to keep it cool. |
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| The most common type of system memory, it requires refreshing every few milliseconds. |
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| A processor package that contains two core processors, thus supporting four instructions at once. |
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| Enhanced Intel SpeedStep Technology (EIST) |
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| A processor feature used by Intel that steps down processor frequency when the processor is idle to conserve power and lower heat. |
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| A processor security feature by Intel that prevents software from executing or reproducing itself if it appears to be malicious. |
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| The bus between the CPU and memory on the motherboard. |
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| A piece of metal, with cooling fins, that can be attached to or mounted on an integrated chip (such as the CPU) to dissipate heat. |
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| The Intel technology that allows each logical processor within the processor package to handle an individual thread in parallel with other threads being handled by other processors within the package. |
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| The AMD technology that allows each logical processor within the processor package to handle an individual thread in parallel with other threads being handled by other processors within the package. |
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| The bus inside the CPU that is used for communication between the CPU’s internal components. |
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| Memory on the processor die used as a cache to improve processor performance. |
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| Memory in the processor package, but not on the processor die. The memory is used as a cache or buffer to improve processor performance. |
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| Cache memory further from the processor core than Level 2 cache, but still in the processor package. |
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Definition
| A method to cool overclocked processors that uses a small pump inside the computer case and tubes that move water or other liquid around components and then away from them to a place where fans can cool the liquid. |
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| A small amount of faster RAM that stores recently retrieved data, in anticipation of what the CPU will request next, thus speeding up access. |
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| A programming instruction that can be executed by a CPU without breaking the instruction down into simpler instructions. |
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| MMX (Multimedia Extensions) |
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Definition
| Multimedia instructions built into Intel processors to add functionality such as better processing of multimedia, SIMD support, and increased cache. |
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Definition
| A processor technology whereby the processor housing contains two or more processor cores that operate at the same frequency, but independently of each other. |
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| The factor by which the bus speed or frequency is multiplied to get the CPU clock speed. |
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| A system that contains more than one processor. |
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| A processor package that contains eight cores and supports 16 instructions at once. |
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| Running a processor at a higher frequency than is recommended by the manufacturer, which can result in an unstable system, but is a popular thing to do when a computer is used for gaming. |
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Definition
| Standards for processors established by ACPI that define how processor frequency and voltage can be lowered to conserve power when the processor is not in use. |
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| An AMD technology that increases performance and lowers power requirements for processors. |
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Definition
| The frequency at which the CPU operates, usually expressed in GHz. |
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| A processor package that contains four cores and supports eight instructions at once. |
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| The ACPI power saving mode where the hard drive and monitor are turned off and everything else runs normally. |
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Definition
| The ACPI power saving mode where the hard drive, monitor, and processor are turned off. |
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Term
| S3 state (sleep/standby mode) |
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Definition
| The ACPI power saving mode where everything is shut down except RAM and enough of the system to respond to a wake-up call such as pressing the keyboard. |
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Definition
| The ACPI power saving mode where everything in RAM is copied to a file on the hard drive and the system is shut down. When the system is turned on, the file is used to restore the system to its state before shut down. |
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| SIMD (single instruction, multiple data) |
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Definition
| A process that allows the CPU to execute a single instruction simultaneously on multiple pieces of data, rather than by repetitive looping. |
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| RAM chips that retain information without the need for refreshing, as long as the computer’s power is on. They are more expensive than traditional DRAM. |
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| SSE (Streaming SIMD Extension) |
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Definition
| A CPU technology that allows the CPU to receive a single instruction and then execute it on multiple pieces of data, and also improves on 3D graphics. |
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| An improved version of SSE that has a larger instruction set. |
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| A CPU instruction set that improved on the earlier SSE2 instruction set. |
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| A CPU instruction set that improved 3D imaging for gaming and improved performance with data mining applications over the earlier SSE3 instruction set. |
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| An error at the kernel level that is severe enough to cause the operating system to stop all processes. |
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| A creamlike substance that is placed between the bottom of the cooler heatsink and the top of the processor to eliminate air pockets and to help to draw heat off the processor. |
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| A processor package that contains three core processors, thus supporting six instructions at once. |
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