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THE TEMPERATURE IN WHICH THE FIRST SOLID BEGINS TO FORM DURING SOLIDIFICATION |
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IT'S A PHASE DIAGRAM IN WHICH THE COMPONENTS DISPLAY UNLIMITED SOLID SOLUBILTIY |
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TOTAL LENGTH OF DISLOCATIONS PER CUBIC CENTIMETER IN A MATERIAL |
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EXPLAINS PLASTIC DEFORMATION THROUGH A SOLID. IMPEDING DISLOCATIONS WILL MAKE MATERIAL HARD, LESS DUCTILE. (GRAIN BOUNDARIES) |
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ALLOYS THAT HAVE COMPOSTIONS THAT ARE GREATER THAN EUTECTIC COMPOSITIONS |
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HOMOGENOUS REGION OF MATERIAL |
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DEFORMATION BELOW ITS RECRYSTALLIZATION TEMP |
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A SOLID THAT IS COMPOSED OF TWO COMPONENTS BUT EXISTS AS SINGLE PHASE |
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REGION OF MISMATCH BETWEEN TWO GRAINS. BIGGER ASTM #, MORE GRAINS, HARDER MATERIAL |
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CONGRUENT TRANSFORMATION (MELTING, COOLING) |
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A TRANSFORMATION FROM ONE PHASE TO ANOTHER OF THE SAME COMPOSITION |
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SMALL REPETITIVE VOLUME THAT COMPRISES THE ENTIRE CRYSTALLINE STRUCTURE OF A SOLID |
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COMBINATION OF UNIT CELL EDGE LENGTHS AND INTERAXIAL ANGLES THAT DEFINE THE UNIT CELL GEOMETRY |
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SPECIAL SHORTHAND NOTATION TO DESCRIBE THE CRYSTALLOGRAPHIC PLANES IN MATERIAL |
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DEFINES CRYSTAL STRUCTURE |
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MATERIALS RESISTANCE TO SURFACE INDENTATION OR A MEASURE OF PLASTIC DEFORMATION |
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NUMBER OF CYCLES PERMITTED AT A PARTICULAR STRESS BEFORE A MATERIAL FAILS BY FATIGUE |
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THE STRESS TO CAUSE FAILURE BY FATIGUE IN A GIVEN NUMBER OF CYCLES |
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STRESS BELOW WHICH A MATERIAL WILL NOT FAIL IN FATIGUE TEST |
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AREA UNDER STRESS-STRAIN CURVE, ENERGY REQUIRED TO CAUSE FAILURE. MEASURED BY AREA UNDER CURVE, IMPACT TEST, FRACTURE TOUGHNESS |
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ABILITY OF A MATERIAL TO BE PLASTICALLY DEFORMED. MEASURED BY % REDUCTION IN AREA AND % ELONGATION |
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ABILITY TO GO BACK TO ORIGINAL FORM |
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MEASURES THE ABILITY OF A MATERIAL TO ABSORB A SUDDEN APPLICATION OF A LOAD WITHOUT BREAKING |
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FRACTION OF SPACE IN A CRYSTAL STRUCTURE OCCUPIED BY ATOMS |
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WHERE A MATERIAL EXISTS IN TWO OR MORE CRYSTAL STRUCTURES |
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ONE OF THE CRYSTALS PRESENT IN POLYCRYSTALLINE MATERIAL |
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WHEN TWO ATOMS SHARE AN ELECTRON |
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SLOW DEFORMATION AT STRESSES BELOW THE NORMAL YIELD STRENGTH, USUALLY AT ELEVATED TEMPERATURES |
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